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List of our references
List of our references
Ultrasonic Soldering System Overview:
USS-9110MkII - low cost / evaluation system for low volume applications. Limited functions but fully operative.
- 10W soldering hand tool, operates tip diameters 1.0 - 4.0mm - For manual operation only - Frequency: auto tuning 60kHz - Ultrasonic output power: 4 - 10 W - Temperature range 150°C - 480°C - Calibration of frequency - Mains power 100V - 240V AC, 48 - 65 Hz |
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USS-9210MkII
- 15W soldering hand tool, operates tip diameters 1.0 - 6.0mm - For manual and robot applications - Frequency: auto tuning 60kHz - Ultrasonic output power: 5 - 15 W - Temperature range 150°C - 480°C (low temp mode: down to 50°C) - Calibration of frequency and tip temperature - Mains power 100V - 240V AC, 48 - 65 Hz - LED displays for heat control and sonic control - Serial data interface for remote control - internal menu for parametrisation - prepared for upgrade with ASC-9000 air control system for operation with hot gas function for increased heat supply |
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USS-9210MkII AIR - ultrasonic soldering system including air flow control for enhanced heat flow to the substrate
- 15W soldering hand tool, operates tip diameters 1.0 - 6.0mm - For manual and robot applications - Frequency: auto tuning 60kHz - Ultrasonic output power: 5 - 15 W - Temperature range 150°C - 480°C (low temp mode: down to 50°C) - Calibration of frequency and tip temperature - Mains power 100V - 240V AC, 48 - 65 Hz - LED displays for heat control and sonic control - Serial data interface for remote control - internal menu for parametrisation - air supply control system with adjustable air-flow meter and - pressure reducer from shop air - electrical air valve to switch the air on and off |
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USS-9510MkII
- 30W soldering hand tool, operates tip diameters round 6.0 - 12.0mm, rectangular up to 6 x 30mm - For manual and robot applications - Frequency: auto tuning 40kHz - Ultrasonic output power: 9 - 30 W - Temperature range 150°C - 480°C (low temp mode: down to 50°C) - Calibration of frequency and tip temperature - Mains power 100V - 240V AC, 48 - 65 Hz - LED displays for heat control and sonic control - Serial data interface for remote control - Internal menu for parametrisation - prepared for upgrade with ASC-9000 air control system for operation with hot gas function for increased heat supply |
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USS-1908MkII
- operates 15W and 30W soldering iron tools - include air-flow control system with valve and air-flow meter - For manual and robot applications, i.e. built-in robot equipment - powerful continuous operation - Frequency: auto tuning 60kHz or 40kHz - Ultrasonic output power: 5 - 15 W or 9 - 30 W - Temperature range 150°C - 480°C (low temp mode: down to 50°C) - Mains power 100V - 240V AC, 48 - 65 Hz - LED displays for heat control and sonic control - calibration of frequency - calibration of soldering tip temperature - Serial data interface for controlling of soldering parameters and operation from the computer resp. PLC - internal menu for parametrisation |
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Position Control System PosCon-1900
A constant, defined contact force of the soldering tip on the substrate is essential in automated ultrasonic soldering. Therefore a reproducible, precise force control of the contact force of the soldering tip is necessary for perfect soldering results. For this specific purpose, the PosCon- 1900, a self-contained, motorised Z-axis, has been developed to accommodate the ultrasonic robot soldering heads # 9200-127 and 9500-127. With constant soldering tip force, the system can automatically compensate substrate height differences of up to +/- 15mm. |
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How ultrasonic soldering works. . .
Ultrasonic soldering is a fluxless soldering process that uses ultrasonic energy. This means it is a clean soldering process that does not require chemicals to clean the base and solder materials. Soldering without flux can be done on glass, ceramics, and composites, hard to solder metals and other sensitive components which cannot be soldered using conventional means. Ultrasonic soldering technology is finding growing application in soldering of metals and ceramics from solar photovoltaic's and medical shape memory alloys (Nitinol) to specialized electronic and sensor packages. It is an established process and has been reported since 1940th as a method to solder aluminum and other metals without the use of flux. With the advent of "active solders" the utility of ultrasonic soldering technology is growing even faster.
Ultrasonic soldering is a distinctly different process than ultrasonic welding. Ultrasonic welding uses ultrasonic energy to join parts without adding any kind of filler material while ultrasonic soldering uses external heating to melt filler metal materials, namely solders, to form a joint. Ultrasonic soldering is being done with a specialized soldering iron. The process can be automated for large-scale production or can be done by hand for prototyping or repair work. Initially, ultrasonic soldering was aimed at joining aluminum and other metals. However, with the emergence of active solders, a much wider range of metals, ceramics and glass can be soldered.
Ultrasonic soldering uses ultrasonically coupled heated solder iron tips (0.5 – 10 mm). In these devices, piezoelectric crystals are used to generate high frequency (20 – 60 kHz) acoustic waves in molten solder layers or batch, to mechanically disrupt oxides that form on the molten solder surfaces. The tips for ultrasonic soldering irons are also coupled to a heating element while the piezoelectric crystal is thermally isolated, not to degrade the piezoelectric element. Ultrasonic soldering iron tips can heat (up to 480°C) while mechanically oscillating at 20 – 60 KHz. This soldering tip can melt solder filler metals as acoustic vibrations are induced in the molten solder pool. The vibration and cavitation in the molten solder then permits solders to wet and adhere to many metal surfaces.
The acoustic energy created by the solder tip or ultrasonic solder pot works via cavitation of the molten solder which mechanically disrupts oxide layers on the solder layers themselves and on metal surfaces being joined.
A schematic of the ultrasonic soldering process is illustrated above.
Ultrasonic soldering is a distinctly different process than ultrasonic welding. Ultrasonic welding uses ultrasonic energy to join parts without adding any kind of filler material while ultrasonic soldering uses external heating to melt filler metal materials, namely solders, to form a joint. Ultrasonic soldering is being done with a specialized soldering iron. The process can be automated for large-scale production or can be done by hand for prototyping or repair work. Initially, ultrasonic soldering was aimed at joining aluminum and other metals. However, with the emergence of active solders, a much wider range of metals, ceramics and glass can be soldered.
Ultrasonic soldering uses ultrasonically coupled heated solder iron tips (0.5 – 10 mm). In these devices, piezoelectric crystals are used to generate high frequency (20 – 60 kHz) acoustic waves in molten solder layers or batch, to mechanically disrupt oxides that form on the molten solder surfaces. The tips for ultrasonic soldering irons are also coupled to a heating element while the piezoelectric crystal is thermally isolated, not to degrade the piezoelectric element. Ultrasonic soldering iron tips can heat (up to 480°C) while mechanically oscillating at 20 – 60 KHz. This soldering tip can melt solder filler metals as acoustic vibrations are induced in the molten solder pool. The vibration and cavitation in the molten solder then permits solders to wet and adhere to many metal surfaces.
The acoustic energy created by the solder tip or ultrasonic solder pot works via cavitation of the molten solder which mechanically disrupts oxide layers on the solder layers themselves and on metal surfaces being joined.
A schematic of the ultrasonic soldering process is illustrated above.
Our References of Universities and National Research Laboratories
on reasons of confidentiality, companies are not listed.
- THE AMERICAS
U.S.A.
Argonne National Laboratory - Chicago, IL
Auburn University - Auburn, AL
Boston University - Boston, MA
Brigham Young University - Provo, UT
Brookhaven National Laboratory - New York, NY
Brown University - Providence, RI
Fermi National Accelerator Laboratory - Batavia, IL
Howard Hughes Medical Institute - Ashburn, VA
Johns Hopkins University - Laurel, MD
Kent State University - Kent, OH
Lawrence Livermore National Laboratory - Livermore, CA
MIT, Cambridge, MA
National Nuclear Security Administration - Las Vegas, NV
Northwestern University - Evanston, IL
Penn State University - Pensylvania, PA
Sandia National Laboratories - Albuquerque, NM
SLAC National Accelerator Lab - Menlo Park, CA
Stanford University - Stanford, CA
Texas A&M University - Texas, TX
Texas Tech University - Texas, TX
UC Lawrence Berkeley Lab - Los Angeles, CA
UCLA - Los Angeles, CA
University of California - Berkeley, CA
University of California - San Diego, CA
University of Arizona - Tucson, AZ
University of Louisville, KY
University of Michigan, MI
University of Mississippi - University, MS
University of Notre Dame - Indianapolis, IN
University of Pittsburgh - Pittsburgh, PA
University of Texas at Dallas, TX
University of Texas at El Paso, TX
University of Tulsa - Tulsa, OK
University of Waterloo - Waterloo, IA
University of Washington - Washington, DC
Wayne State University - Detroit, MI
Canada
Canadian Nuclear Laboratories - Chalk River ON
Conseil National de Recherches - Boucherville QC
University of British Columbia - Vancouver
University of Toronto, Ontario
University of Waterloo, Ontario
Brasil
Brasil University - FAPESP - Sao Paulo
Universidade de Sao Paulo - Sao Paulo
Venezuela
Instituto Venezolano de Investigaciones Cientificas - Miranda
- EUROPE
Switzerland
CERN - European Organization for Nuclear Research - Geneva
CSEM - Neuchâtel
EMPA - Dübendorf
EPFL - École Polytechnique Fédérale - Lausanne
EPFL - École Polytechnique Fédérale - Neuchâtel
EPFL - École Polytechnique Fédérale - Sion
ETH - Eidg. Technische Hochschule - Zurich
HSR - Hochschule für Technik - Rapperswil
METAS - Berne
PSI - Paul Scherrer Institut - Villigen
Universität Bern - Bern
University of Zurich
Austria
Technische Universität - Atominstitut - Wien
Belgium
Imec - Leuven
KU Leuven - Leuven
SCK-CEN Belgian Nuclear Research Centre - Mol
Czech Republic
J. Heyrovsky Institute - Praha
Institute of Scientific Instruments - Brno
Denmark
Roskilde University
Estonia
Tallinn University of Technology
Finland
Aalto University - Applied Physics
VTT Technical Research Centre of Finland Ltd - Espoo
France
CEA - Grenoble
CEA - Saclay
CNRS - ENSCP - Paris
CNRS - Université de Picardie Jules Verne - Amiens
CNRS - Université Nantes
CNRS - Institut non Linéaire de Nice - Valbonne
Ecole Polytechnique LPICM - Palaiseau
ESPCI - École supérieurd de physique et de chimie industrielles de la ville Paris
Lab. Physique Ecole Normale Supérieure - Lyon
Université de Bordeau - Talence
IPVF - Institut Photovoltaique d'île-de-France
Université Lille 1 - Villeneuve d'Ascq
Université du Littoral Côte d'Opale -Dunkerque
Université Paris Diderot - Paris
Université de Tours
Germany
DLR - Oberpfaffenhofen
Forschungsinstitut für Nichteisen-Metalle - Freiberg
Forschungszentrum Jülich
Fraunhofer Institut - Berlin
Fraunhofer Institut IKTS - Dresden
Fraunhofer Institut ISE - Freiburg
Fraunhofer Institut ILT - Aachen
Fraunhofer Institut IPM - Freiburg
Helmholtz Zentrum - Berlin
Hochschule Coburg - ISAT
ISFH - Emmerthal
IFW - Jena
IPHT - Jena
KIT Physikalisches Institut - Karlsruhe
Max Planck Institut - Bonn
Max Planck Institut - Heidelberg
Max Planck Institut - Kaiserslautern
Physikalisch-Technische Bundesanstalt - Braunschweig
RWTH Aachen University
Technische Universität Berlin
Technische Universität München
Thüringisches Institut für Textil- und Kunststoff-Forschung - Rudolfstadt
Universität Bayreuth
Universität Bremen - ZARM
Universität der Bundeswehr - München
Universität Erfurt
Universität Hannover
Universität Heidelberg
Universität Kassel
Universität für Materialwissenschaften - Jena
Universität Oldenburg
Universität Stuttgart IPV
Universität Tübingen
ZAE Bayern - Würzburg
Greece
FORTH - Herakion
Israel
Bar-Ilan University - Tel Aviv
Technion - Israel Institute of Technology - Haifa
The Weizmann Institute of Science - Rehovot
Italy
Elettra Sincotrone - Trieste
INFN - Istitute Nazionale di Fisica Nucleare - Pisa
Politecnico di Torino
Università della Calabria - Arcavacanta di Rende
Università La Sapienza di Roma
Università Piemonte Orientale Amedeo - Alessandria
Luxembourg
Université de Luxembourg
Netherlands
NIK HEF Nationaal Instituut voor Kernfysica - Amsterdam
Technische Universität Delft
University Leiden
Norway
FFI Norwegian Defence Research Institute - Kjeller
University of Tromsö
University of Oslo
United Kingdom
Bangor University - Bangor
Brunel University - Brunel
University of Exeter - Exeter
University of Glasgow - Glasgow
Imperial College - London
Heriot-Watt University - Edingburgh
Loughborough University - Loughborough
Newcastle University - Newcastle upon Tyne
Oxford University - Oxford
University of Nottingham - Nottingham
Swansea University - Swansea
University of Bristol - Bristol
Queen's University Belfast - N. Ireland
University of Ulster - N. Ireland
University of Surrey
University Queen Mary - London
Ireland
University of Limerick - Ireland
Poland
Military University of Technology - Warsaw
Warsaw University of Technology - Warsaw
Portugal
Universidade Lisboa
University of Porto
Slovenia
Institut Jozef Stefan - Ljubljana
University of Ljubljana
Spain
CIN2 - Centre d'Investigacio en Nanociencia - Ballaterra
ICIQ - Instiute of Chemical Research of Catalonia - Tarragona
IFAE - Institut de Fisica d'Altes Energies - Bellaterra
Instituto de Tecnologia Cerámica Unidad de Compras - Castellón
University of Barcelona
Universitat Jaume I - Castellon
University of Lleyda
University Pablo de Olavide - Sevilla
University of Valencia
University of Zaragoza - INMA
Sweden
University Kunglia Tekniska Högskolan - Stockholm
Universitet Uppsala
Turkey
Boğaziçi University - Istanbul
Ege University Solar Energy Institute - Izmir
- AUSTRALIA
Australian Department of Defence - Canberra
Australian National University - Canberra
CSIRO - Victoria
Flinders University - Bedford Park, SA
Griffith University - Queensland
Macquarie University - Sydney NSW
Monash University - Victoria
RMIT Applied Chemistry - Melbourne
University of Queensland - Brisbane
University of Western Australia - Perth
University of Wollongong - New South Wales
UNSW Kensington - NSW
- ASIA
China
China Academy of Engineering Physics, Mianyang
China Three Gorges University, Yichang
Dalian Institute of Chemical Physics - Dalian
East China University of Sience and Technology, Shanghai
Guangxi University, Nanning
Hefei Institutes of Physical Science, Chinese Academy of Science, Anhui
Huaqiao University, Quanzhou
Huazhong University of Science and Technology HUST - Wuhan
Hubei University of Art and Science
Institute of Chemistry Chinese Academy of Sciences, Beijing
Institut of Solid State Physics ISSP - Hefei
Nanjing University of Aeronautics and Astronautics
Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen
South China Normal University, Guangzhou
Sun Yat-Sen University, Guangzhou
Wenzhou University, Wenzhoua
Wuhan National Laboratory for Optoelectronics, WNLO
Wuhan University of Technology
Xiamen Institute of Rare EWarth Materials, Xiamen
Xi’an Jiaotong University - Xi'an
Zhejiang University, Hangzhou
Hong Kong
Hong Kong University
Polytechnic University of Hong Kong - Kowloon
India
ARCI - Hyderabad
BARC - Bhabha Atomic Research Centre - Mumbai
Indian Institute of Science - Bangalore
Inter University Accelerator Center - New Delhi
National Chemical Laboratory - Pune
SSN College of Engineering - Tamil Nadu
TATA Institute of Fundamental Research - Mumbai
Katar
Qatar University - Doha
Kazakhstan
Nazarbayev University - Nur-Sultan City
Malaysia
Universiti Teknologi Petronas - Penang
Pakistan
University of Engineering and Technology (UET), Peshawar
Saudi Arabia
King Abdullah University of Science & Technology - Thuwal
Najran University - Saudi Arabia
Singapore
National University of Singapore
South Korea
KAIST - Korean Advanced Institut of Technology - Daejeon
KAERI - Korea Atomic Energy Research Institut - Daejeon
KENTECH Korea - Institute of Energy Technology - Jeonnam
Konkuk University - Seoul
Taiwan
National Tsing Hua University - Hsinchu
United Arab Emirates
Technology Innovation Institute - Abu Dhabi
Vietnam
Hanoi University of Technology HUT - Hanoi